Figure 1. Structural diagram of BBCube 3D (IMAGE)

Tokyo Institute of Technology

Figure 1. Structural diagram of BBCube 3D

Caption

The proposed technology uses a stacked design where processing units (xPU) sit atop multiple interconnected memory layers (DRAM). By replacing wires with through-silicon vias (TSVs), the lengths of the connections can be shortened, leading to better overall electrical performance.

Credit

Profesor Takayuki Ohba

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License

CC BY-NC-ND

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