Half-Heusler materials (IMAGE) Penn State Caption Half-Heusler materials may provide a boost in cooling power density of thermoelectric devices and provide a cooling solution for next generation of high-power electronics. Credit Courtesy Wenjie Li Usage Restrictions Credit must be given to the creator. Only noncommercial uses of the work are permitted. No derivatives or adaptations of the work are permitted. License CC BY-NC-ND Disclaimer: AAAS and EurekAlert! are not responsible for the accuracy of news releases posted to EurekAlert! by contributing institutions or for the use of any information through the EurekAlert system.